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  lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 1 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com smd ? 18-038/rsghbhc1-s01/2t features ? pac kage in 8mm tape on 7 ? diameter reel ? compatible with automatic placement equipment ? compatible with infrared and vapor phase reflow ? solder process ? full-color type ? pb-free ? component solderable surface finish is gold ? component weight is 1.0 mg ? rohs compliant description ? the 18-038 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? moreover, with its black pcb, the 19-037 possess an ideal solution for high-contract and high-resolution indoor signage display. applications ? indoor signage display applications ? indoor decorating and entertainment design ? flat backlight for lcd, switch and symbol ? indicator and backlighting for all consumer electronics
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 2 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com device selection guide chip materials emitted color resin color algainp brilliant red ingan brilliant green ingan brilliant blue water clear absolute maximum ratings (ta=25 ) 
parameter symbol rating unit reverse voltage v r 5 v forward current i f rs:25 gh:20 bh:20 ma peak forward current (duty 1/10 @1khz) i fp rs:60 gh:50 bh:50 ma power dissipation pd rs:60 gh:70 bh:70 mw junction temperature t j 100 
operating temperature t opr -40 ~ +85 
storage temperature tstg -40 ~ +90 
esd (classification acc. aec q101) esd hbm r:2000 g:150 b:150 v soldering temperature t sol reflow soldering : 260 
for 10 sec. hand soldering : 350 
for 3 sec.
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 3 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com electro-optical characteristics (ta=25 ) 
parameter symbol min. typ. max. unit condition rs 130 ----- 226 gh 160 ----- 336 luminous intensity iv bh 40 ----- 84 mcd i f =20ma viewing angle 2 1/2 ----- 120 ----- deg i f =20ma rs 632 gh 518 peak wavelength p bh ----- 468 ----- nm i f =20ma rs 619.0 628.0 gh 521.5 529 dominant wavelength d bh 466.0 ----- 473.5 nm i f =20ma rs 20 gh 25 spectrum radiation bandwidth ? bh ----- 25 ----- nm i f =20ma rs 1.7 2.0 2.4 gh 2.7 3.3 3.7 forward voltage v f bh 2.7 3.3 3.7 v i f =20ma reverse current i r ----- ----- 10 a v r =5v note: 1. tolerance of luminous intensity: 10% 2. tolerance of dominant wavelength: 1nm 3. tolerance of forward voltage: 0.1v
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 4 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com floating bin(rs) bin range of luminous intensity bin code min. max. unit condition a 130 156 b 156 188 c 188 226 mcd i f =20ma bin range of dominant wavelength bin code min. max. unit condition 1 619 622 2 622 625 3 625 628 nm i f =20ma floating bin(gh) bin range of luminous intensity bin code min. max. unit condition a 160 194 b 194 233 c 233 280 d 280 336 mcd i f =20ma bin range of dominant wavelength bin code min. max. unit condition 1 521.5 524.0 2 524.0 526.5 3 526.5 529.0 nm i f =20ma note: 1.tolerance of luminous intensity: 10% 2.tolerance of dominant wavelength: 1nm
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 5 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com floating bin(bh) bin range of luminous intensity bin code min. max. unit condition a 40 48 b 48 58 c 58 70 d 70 84 mcd i f =20ma bin range of dominant wavelength bin code min. max. unit condition 1 466.0 468.5 2 468.5 471.0 3 471.0 473.5 nm i f =20ma note: 1.tolerance of luminous intensity: 10% 2.tolerance of dominant wavelength: 1nm
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 6 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com typical electro-optical characteristics curves radiation diagram ta=25c 80 0.2 0.5 0.1 0.3 90 0.4 0.6 10 0.7 0.8 1.0 0.9 0 50 70 60 40 30 20 25 0 50 75 100 ta=25c r e l a t i v e l u m i n o u s i n t e n s i t y ( % ) wavelength (nm) spectrum distribution 400 550 450 500 600 650 700 red green blue forward voltage v (v) f o r w a r d c u r r e n t i ( m a ) f forward voltage f ta=25c forward current vs. 0 10 20 25 30 40 50 2.8 2.0 1.6 2.4 4.2 3.4 3.0 3.8 red green blue forward current derating curve forward current i (ma) fp 0 1 0 2 3 4 5 40 20 60 100 80 r e l a t i v e l u m i n o u s i n t e n s i t y red green blue
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 7 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com ambient temperature vs. ambient temperature ta (c) 0 t o t a l p o w e r d i s s i p a t i o n 50 0 100 150 ( m w ) 200 250 40 20 60 100 85 total power dissipation ambient temperature ta (c) 0 t o t a l p o w e r d i s s i p a t i o n 50 0 100 150 ( m w ) 200 250 40 20 60 100 85 red green blue ambient temperature vs. power dissipation
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 8 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com package dimension note: tolerances unless mentioned 0.1mm. unit = mm
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 9 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com moisture resistant packing materials label explanation cpn: customer ? ?s product number p/n: product number ? qty: packing quan ? tity cat: luminous intensity rank ? hue: dom. wavelength rank ? ref: forward voltage rank ? lot no: lot number ? reel dimensions
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 10 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com carrier tape dimensions: loaded quantity 2000 pcs per reel note: tolerances unless mentioned 0.1mm. unit = mm moisture resistant packing process note: tolerances unless mentioned 0.1mm. unit = mm
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 11 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com precautions for use 1. over-current-proof customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 
or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 168hrs under 30 
or less and 60% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 605 
for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board.
lifecyclephase: revision : 1 expired period: forever release date:2011-02-23 17:07:30.0 datasheet smd 18-038/rsghbhc1-s01/2t 12 copyright ? 2010, everlight all rights reserved. release date : 21-feb-2011. issue no: dse-0004868_v1. www.everlight.com 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 
for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. everlight electronics co., ltd. tel: 886-2-2267-2000, 2267-9936 office: no 25, lane 76, sec 3, chung yang rd, fax: 886-2267-6244, 2267-6189, 2267-6306 tucheng, taipei 236, taiwan, r.o.c http://www.everlight.com


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